Image-capturing module for simplifying optical component

ABSTRACT

An image-capturing module for simplifying optical component includes a first substrate unit, an image-capturing unit, an optical imaging unit, a second substrate unit, a light-emitting unit and a cover unit. The second substrate unit is disposed on the outer surface of the optical imaging unit and electrically connected to the first substrate unit. The light-emitting unit has a light-emitting element electrically disposed on the second substrate unit. The cover unit has a reflective layer formed on an inner surface thereof. Therefore, the light beams generated by the light-emitting element are reflected by the reflective layer to form first reflected light beams projected onto the object, then the first reflected light beams are reflected by the object to form second reflected light beams projected onto the optical imaging unit, and then the second reflected light beams pass through the optical imaging unit and project onto the image-capturing unit.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an image-capturing module, inparticular, to an image-capturing module for simplifying opticalcomponent.

2. Description of Related Art

A personal fingerprint is a unique bio-feature different from those ofothers. When used as a personal secret code, it is extremely secure.Because of the popularity of electronic device and the increase of theirstorage capacities, the protection for personal data stored thereinbecomes increasingly important. Using a fingerprint for unlockingelectronic device or as a secret code can make management of personaldata more efficient. Electronic device such as a mobile phone, acomputer host, and various kinds of computer peripherals can make use ofa fingerprint scanning device to capture a user's fingerprint foridentity confirmation. After the fingerprint image in the fingerprintscanning device is converted into digital fingerprint information, it iseasy to transmit the digital fingerprint information to a controller inthe electronic device to exploit fully the effect of fingerprintidentification.

Referring to FIG. 1, the related art provides an image-capturing moduleincluding a PCB P, an image sensor S electrically disposed on the PCB P,an LED D electrically disposed on the PCB P, a condensing lens Gdisposed above the image sensor S, and a light-guiding element Tdisposed above the LED D. The image capturing process of the related artis shown as follows: (1) light beams L generated by the LED D are guidedby the light-guiding element T to form a projecting light beams L′ thatproject onto the object F above the condensing lens G; next (2) theprojecting light beams L′ are reflected by the object F to formreflecting light beams L″ that project onto the condensing lens G; andthen (3) the reflecting light beams L″ pass through the condensing lensG and project onto the image sensor S in order to capture the imageinformation of one surface of the object F.

SUMMARY OF THE INVENTION

In view of the aforementioned issues, the present invention provides animage-capturing module for simplifying optical component. For example,the light-guiding element of the related art can be omitted in thepresent invention in order to simplify optical component.

To achieve the above-mentioned objectives, the present inventionprovides an image-capturing module for simplifying optical component,including: a first substrate unit, an image-capturing unit, an opticalimaging unit, a cover unit, a second substrate unit and a light-emittingunit. The image-capturing unit has at least one image-capturing elementelectrically disposed on the first substrate unit. The optical imagingunit is disposed on the first substrate unit and covering theimage-capturing unit, and the optical imaging unit has at least oneinsulative layer formed on an outer surface thereof. The cover unit isdisposed on the first substrate unit and covering the optical imagingunit. The cover unit has at least one inclined surface formed on aninner surface thereof and a light-transmitting element disposed on a topsurface thereof and above the optical imaging unit, and an object isdisposed on the light-transmitting element. The second substrate unit isdisposed on the inclined surface of the cover unit and electricallyconnected to the first substrate unit. The light-emitting unit has atleast one light-emitting element electrically disposed on the secondsubstrate unit.

Therefore, light beams generated by the at least one light-emittingelement are reflected by the at least one reflective layer to form firstreflected light beams projected onto the object on thelight-transmitting element, then the first reflected light beams arereflected by the object to form second reflected light beams projectedonto the light-condensing element, and then the second reflected lightbeams pass through the optical imaging unit and project onto theimage-capturing unit.

To achieve the above-mentioned objectives, the present inventionprovides an image-capturing module for simplifying optical component,including: a substrate unit, an image-capturing unit, an optical imagingunit, a light-emitting unit and a cover unit. The image-capturing unithas at least one image-capturing element electrically disposed on thesubstrate unit. The optical imaging unit is disposed on the substrateunit and covering the image-capturing unit. The optical imaging unit hasat least one inclined surface formed on an outer surface thereof, andone end of the substrate is electrically disposed on the at least oneinclined surface. The light-emitting unit has at least onelight-emitting element electrically disposed on the end of the substrateunit and above the at least one inclined surface. The cover unit isdisposed on the substrate unit and covering the optical imaging unit andthe light-emitting unit. The cover unit has at least one reflectivelayer formed on an inner surface thereof and a light-transmittingelement disposed on a top surface thereof and above the optical imagingunit, and an object is disposed on the light-transmitting element.

Therefore, light beams generated by the at least one light-emittingelement are reflected by the at least one reflective layer to form firstreflected light beams projected onto the object on thelight-transmitting element, then the first reflected light beams arereflected by the object to form second reflected light beams projectedonto the light-condensing element, and then the second reflected lightbeams pass through the optical imaging unit and project onto theimage-capturing unit.

To achieve the above-mentioned objectives, the present inventionprovides an image-capturing module for simplifying optical component,including: a first substrate unit, an image-capturing unit, an opticalimaging unit, a second substrate unit, a light-emitting unit and a coverunit. The image-capturing unit has at least one image-capturing elementelectrically disposed on the substrate unit. The optical imaging unit isdisposed on the substrate unit and covering the image-capturing unit.The optical imaging unit has at least one inclined surface formed on anouter surface thereof, and one end of the substrate is electricallydisposed on the at least one inclined surface. The light-emitting unithas at least one light-emitting element electrically disposed on the endof the substrate unit and above the at least one inclined surface. Thecover unit is disposed on the substrate unit and covering the opticalimaging unit and the light-emitting unit. The cover unit has alight-transmitting element disposed on a top surface thereof and abovethe optical imaging unit and an object is disposed on thelight-transmitting element, and light beams generated by the at leastone light-emitting element is projected directly onto thelight-transmitting element.

Therefore, the light beams are reflected by the object to form reflectedlight beams projected onto the optical imaging unit, and then thereflected light beams pass through the optical imaging unit and projectonto the image-capturing unit.

Hence, the present invention can capture the image information of onesurface of the object by matching the reflective layer and thelight-emitting unit, so that the light-guiding element of the relatedart can be omitted in the present invention in order to simplify opticalcomponent.

In order to further understand the techniques, means and effects thepresent invention takes for achieving the prescribed objectives, thefollowing detailed descriptions and appended drawings are herebyreferred, such that, through which, the purposes, features and aspectsof the present invention can be thoroughly and concretely appreciated;however, the appended drawings are provided solely for reference andillustration, without any intention that they be used for limiting thepresent invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic, schematic view of the image-capturing moduleaccording to the related art;

FIG. 2 is a cross-sectional, schematic view of the image-capturingmodule according to the first embodiment of the present invention;

FIG. 3 is a cross-sectional, schematic view of the image-capturingmodule according to the second embodiment of the present invention;

FIG. 4A is a cross-sectional, schematic view of one type of the opticalimaging unit according to the present invention;

FIG. 4B is a cross-sectional, schematic view of another type of theoptical imaging unit according to the present invention;

FIG. 5 is a cross-sectional, schematic view of the image-capturingmodule according to the third embodiment of the present invention;

FIG. 6 is a cross-sectional, schematic view of the image-capturingmodule according to the fourth embodiment of the present invention;

FIG. 7 is a cross-sectional, schematic view of the image-capturingmodule according to the fifth embodiment of the present invention;

FIG. 8 is a cross-sectional, schematic view of the image-capturingmodule according to the sixth embodiment of the present invention; and

FIG. 9 is a cross-sectional, schematic view of the light-transmittingelement according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 2, the first embodiment of the present inventionprovides an image-capturing module for simplifying optical component,including: a first substrate unit 1, an image-capturing unit 2, anoptical imaging unit 3, a second substrate unit 4, a light-emitting unit5 and a cover unit 6.

The first substrate unit 1 and the second substrate unit 4 both can beprinted circuit boards. However, the above-mentioned definition of thefirst substrate unit 1 and the second substrate unit 4 is just anexample. Any substrate with conductive tracks can be applied to thepresent invention.

Moreover, the image-capturing unit 2 has at least one image-capturingelement 20 electrically disposed on the first substrate unit 1, so thatthe number of the image-capturing element 20 can be adjustable accordingto different requirements. The image-capturing element 20 can be animage sensor, and the image-capturing element 20 can electricallyconnect to analysis software in computer in order to read imageinformation that is captured by the image-capturing element 20.

Furthermore, the optical imaging unit 3 with anti stray light functionis disposed on the first substrate unit 1 and covers the image-capturingunit 2. In the first embodiment, the optical imaging unit 3 has ashading body 30 (for example, a shading layer is coated on the externalsurface of the shading body 30 in order to achieve anti stray lightfunction) and a light-condensing element 31 jointed with the shadingbody 30 and disposed above the image-capturing unit 2. Thelight-condensing element 31 can be a condensing lens for condensinglight beams, and the shading body 30 and the light-condensing element 31can be integrally formed in one piece. In addition, the shading body 30has at least one inclined surface 300 formed on an outer surfacethereof, and the inclined surface 300 can be an inclined plane or aninclined curve, so that the light-emitting unit 5 can be a chemicalphosphor layer attached to the inclined surface 300. The shading body 30has at least one extending plane 301 formed on the outer surface thereofand extended downwards from the inclined surface 300 to the firstsubstrate unit 1. Hence, the light beams are projected onto theimage-capturing unit 2 along a predetermined path by using the opticalimaging unit 3 (it means the optical imaging unit 3 can shade otherexternal stray light), so that the image-capturing unit 2 can obtaincorrect image information.

Moreover, the second substrate unit 4 is disposed on the outer surfaceof the shading body 30 and electrically connected to the first substrateunit 1. For example, the second substrate unit 4 has an inclinedsubstrate 40 disposed on the inclined surface 300 of the shading body30. In addition, the second substrate unit 4 has an extending substrate41 extended downwards from the inclined substrate 40 and disposed on theextending plane 301 and a plane substrate 42 bent outwards from theextending substrate 41 and electrically connected to the first substrateunit 1.

Besides, the light-emitting unit 5 has at least one light-emittingelement 50 electrically disposed on the inclined substrate 40 of thesecond substrate unit 4. For example, the light-emitting element 40 canbe an LED (Light Emitting Diode). However, the above-mentioneddefinition of the light-emitting element 40 is just an example in thefirst embodiment, and any type of light-emitting element can be appliedto the present invention.

Moreover, the cover unit 6 is disposed on the first substrate unit 1 andcovers the optical imaging unit 3, the second substrate unit 4 and thelight-emitting unit 5. The cover unit 6 has at least one reflectivelayer 60 formed on an inner surface thereof and a light-transmittingelement 61 disposed on a top surface thereof and above thelight-condensing element 31, and the object F is disposed on thelight-transmitting element 61 such as transparent glass or plastic. Inother words, the sensing surface of the object F (such as fingerprint offinger) can be disposed on the light-transmitting element 61 to besensed. In addition, the reflective layer 60 can be a reflective elementadhered to the inner surface of the cover unit 6 or a reflective coatedfilm coated on the inner surface of the cover unit 6. In addition, thelight-transmitting element 61 and the condensing element 31 may beconnected to each other or be integrally combined to form one piece.

Therefore, the light beams L generated by the light-emitting element 50are reflected by the reflective layer 60 to form first reflected lightbeams L1 projected onto the object F on the light-transmitting element61, then the first reflected light beams L1 are reflected by the objectF to form second reflected light beams L2 projected onto thelight-condensing element 31, and then the second reflected light beamsL2 pass through the light-condensing element 31 and project onto theimage-capturing unit 2 in order to capture the image information of onesurface of the object F.

Referring to FIG. 3, the second embodiment of the present inventionprovides an image-capturing module for simplifying optical component,including: a first substrate unit 1, an image-capturing unit 2, anoptical imaging unit 3, a second substrate unit 4, a light-emitting unit5 and a cover unit 6.

The difference between the second embodiment and the first embodiment isthat: in the second embodiment, the shading body 30 has at least onefirst inclined surface 300 a and at least one second inclined surface300 b both formed on an outer surface thereof. The second substrate unit4 has a first inclined substrate 40 a disposed on the first inclinedsurface 300 a of the shading body 30 a and a second inclined substrate40 b disposed on the second inclined surface 300 b of the shading body30. The light-emitting unit 5 has at least one first light-emittingelement 50 a electrically disposed on the first inclined substrate 40 aof the second substrate unit 4 and at least one second light-emittingelement 50 b electrically disposed on the second inclined substrate 40 bof the second substrate unit 4. The cover unit 6 has at least one firstreflective layer 60 a and at least one second reflective layer 60 b bothformed on an inner surface thereof.

Moreover, the shading body 30 has at least one first extending plane 301a formed on the outer surface thereof and extended downwards from thefirst inclined surface 300 a to the first substrate unit 1, and thesecond substrate unit 4 has a first extending substrate 41 a extendeddownwards from the first inclined substrate 40 a and disposed on thefirst extending plane 301 a and a first plane substrate 42 a bentoutwards from the first extending substrate 41 a and electricallyconnected to the first substrate unit 1. In addition, the shading body30 has at least one second extending plane 301 b formed on the outersurface thereof and extended downwards from the second inclined surface300 b to the first substrate unit 1, and the second substrate unit 4 hasa second extending substrate 41 b extended downwards from the secondinclined substrate 40 b and disposed on the second extending plane 301 band a second plane substrate 42 b bent outwards from the secondextending substrate 41 b and electrically connected to the firstsubstrate unit 1.

Furthermore, the first light-emitting element 50 a and the secondlight-emitting element 50 b can be light emitting diodes. In addition,the first reflective layer 60 a is a first reflective element adhered tothe inner surface of the cover unit 6 or a first reflective coated filmcoated on the inner surface of the cover unit 6, and the secondreflective layer 60 b is a second reflective element adhered to theinner surface of the cover unit 6 or a second reflective coated filmcoated on the inner surface of the cover unit 6. In addition, thelight-transmitting element 61 and the condensing element 31 may beconnected to each other or be integrally combined to form one piece.

Therefore, light beams L generated by the first light-emitting element50 a and the second light-emitting element 50 b are reflected by thefirst reflective layer 60 a and the second reflective layer 60 b to formtwo sets of first reflected light beams L1 projected onto the object Fon the light-transmitting element 61, then the two sets of the firstreflected light beams L1 are reflected by the object F to formconvergent second reflected light beams L2 projected onto thelight-condensing element 31, and then the second reflected light beamsL2 pass through the light-condensing element 31 and project onto theimage-capturing unit 2 in order to capture the image information of onesurface of the object F.

Referring to FIGS. 4A and 4B, the light-condensing element 31 can bereplaced by the light-transmitting region 32 of the optical imaging unit3. For example, the light-transmitting region 32 can be a hole H asshown in the FIG. 4A, or the light-transmitting region 32 can becomposed of a hole H and a light-transmitting body T filled into thehole H. Hence, the second reflected light beams L2 can pass throughlight-transmitting region 32 of the optical imaging unit 3 and projectonto the image-capturing unit 2 in order to capture the imageinformation of one surface of the object F.

Referring to FIG. 5, the difference between the third embodiment and theabove-mentioned embodiments is that: in the third embodiment, the lightbeams L generated by the light-emitting element 50 are projecteddirectly onto the light-transmitting element 61. Therefore, the lightbeams L are reflected by the object F to form reflected light beams L′projected onto the optical imaging unit 3, and then the reflected lightbeams L′ pass through the optical imaging unit 3 and project onto theimage-capturing unit 2. In addition, the light-transmitting element 61and the condensing element 31 may be connected to each other or beintegrally combined to form one piece.

Referring to FIG. 6, the difference between the fourth embodiment andthe first embodiment is that: in the fourth embodiment, the opticalimaging unit 3 has at least one reflective layer 302 formed on an outersurface thereof. The cover unit 6 has at least one inclined surface 600formed on an inner surface thereof. The second substrate unit 4 isdisposed on the inclined surface 600 of the cover unit 6 and iselectrically connected to the first substrate unit 1. Therefore, thelight beams L generated by the light-emitting element 50 are reflectedby the reflective layer 302 to form first reflected light beams L1projected onto the object F on the light-transmitting element 61 or aredirectly projected onto the object F on the light-transmitting element61 (shown as the dotted line in FIG. 6), then the first reflected lightbeams L1 are reflected by the object F to form second reflected lightbeams L2 projected onto the optical imaging unit 3, and then the secondreflected light beams L2 pass through the optical imaging unit 3 andproject onto the image-capturing unit 2. In addition, thelight-transmitting element 61 and the condensing element 31 may beconnected to each other or be integrally combined to form one piece.

Referring to FIG. 7, the fifth embodiment of the present inventionprovides an image-capturing module for simplifying optical component,including: a substrate unit 1, an image-capturing unit 2, an opticalimaging unit 3, a light-emitting unit 5 and a cover unit 6.

Moreover, the image-capturing unit 2 has at least one image-capturingelement 20 electrically disposed on the substrate unit 1. The opticalimaging unit 3 is disposed on the substrate unit 1 and covers theimage-capturing unit 2. The optical imaging unit 3 has at least oneinclined surface 300 formed on an outer surface thereof, and one end ofthe substrate unit 1 is electrically disposed on the inclined surface300. The light-emitting unit 5 has at least one light-emitting element50 electrically disposed on one end of the substrate unit 1 and abovethe inclined surface 300. The cover unit 6 is disposed on the substrateunit 1 and covers the optical imaging unit 3 and the light-emitting unit5. The cover unit 6 has at least one reflective layer 60 formed on aninner surface thereof and a light-transmitting element 61 disposed on atop surface thereof and above the optical imaging unit 3, and the objectF is disposed on the light-transmitting element 61. In addition, thelight-transmitting element 61 and the condensing element 31 may beconnected to each other or be integrally combined to form one piece.

Therefore, the light beams L generated by the light-emitting element 50are reflected by the reflective layer 60 to form first reflected lightbeams L1 projected onto the object F on the light-transmitting element61, then the first reflected light beams L1 are reflected by the objectF to form second reflected light beams L2 projected onto the opticalimaging unit 3, and then the second reflected light beams L2 passthrough the optical imaging unit 3 and project onto the image-capturingunit 2 in order to capture the image information of one surface of theobject F.

Referring to FIG. 8, the difference between the sixth embodiment and thefifth embodiment is that: in the sixth embodiment, the light beams Lgenerated by the light-emitting element 50 can be projected directlyonto the object F on the light-transmitting element 61. Hence, the lightbeams L are reflected by the object F to form reflected light beams L′projected onto the optical imaging unit 3, and then the reflected lightbeams L′ pass through the optical imaging unit 3 and project onto theimage-capturing unit 2. In addition, the light-transmitting element 61and the condensing element 31 may be connected to each other or beintegrally combined to form one piece.

Referring to FIG. 9, the light-transmitting element 61 has alight-condensing function such as a lens. In other words, thelight-transmitting element 61 may be design as a glass or a lens.

In conclusion, the present invention can capture the image informationof one surface of the object by matching the reflective layer and thelight-emitting unit, so that the light-guiding element of the relatedart can be omitted in the present invention in order to simplify opticalcomponent.

The above-mentioned descriptions merely represent solely the preferredembodiments of the present invention, without any intention or abilityto limit the scope of the present invention which is fully describedonly within the following claims. Various equivalent changes,alterations or modifications based on the claims of present inventionare all, consequently, viewed as being embraced by the scope of thepresent invention.

1. An image-capturing module comprising: a first substrate unit; animage-capturing unit including an image-capturing element disposed onthe first substrate unit and electrically connected to the firstsubstrate unit; an optical imaging unit disposed on the first substrateunit to cover the image-capturing unit, wherein the optical imaging unithas at least one first inclined surface formed on an outer surfacethereof and at least one reflective layer disposed on the at least onefirst inclined surface; a cover unit disposed on the first substrateunit to cover the optical imaging unit, wherein the cover unit includesa light-transmitting element disposed above the optical imaging unit,and the cover unit has at least one second inclined surface formed on aninner surface thereof; a second substrate unit disposed on the at leastone second inclined surface of the cover unit and electrically connectedto the first substrate unit; and a light-emitting unit including atleast one light-emitting element disposed on the second substrate unitand electrically connected to the second substrate unit for generatinglight beams; wherein an object is disposed on the light-transmittingelement, the light beams generated by the at least one light-emittingelement are projected onto the at least one reflective layer andreflected by the at least one reflective layer to form first reflectedlight beams, the first reflected light beams are projected onto theobject through the light-transmitting element and reflected by theobject to form second reflected light beams, and then the secondreflected light beams are projected onto the image-capturing elementthrough the optical imaging unit.
 2. The image-capturing moduleaccording to claim 1, wherein the first substrate unit and the secondsubstrate unit are printed circuit boards, and the image-capturingelement is an image sensor.
 3. The image-capturing module according toclaim 1, wherein the light-emitting element is a light emitting diode.4. The image-capturing module according to claim 1, wherein thereflective layer is a reflective element adhered to the inner surface ofthe cover unit or a reflective coated film coated on the inner surfaceof the cover unit.
 5. An image-capturing module comprising: a substrateunit having a bended end portion; an image-capturing unit including animage-capturing element disposed on the substrate unit and electricallyconnected to the substrate unit; an optical imaging unit disposed on thesubstrate unit to cover the image-capturing unit, wherein the opticalimaging unit has at least one first inclined surface formed on an outersurface thereof, and the bended end portion of the substrate unit isbent and disposed on the at least one first inclined surface of theoptical imaging unit; a light-emitting unit including at least onelight-emitting element disposed on the bended end portion of thesubstrate unit and electrically connected to the bended end portion ofthe substrate unit for generating light beams; and a cover unit disposedon the substrate unit to cover the optical imaging unit and thelight-emitting unit, wherein the cover unit includes alight-transmitting element disposed above the optical imaging unit, andthe cover unit has at least one second inclined surface formed on aninner surface thereof and at least one reflective layer disposed on theat least one second inclined surface; wherein an object is disposed onthe light-transmitting element, the light beams generated by the atleast one light-emitting element are projected onto the at least onereflective layer and reflected by the at least one reflective layer toform first reflected light beams, the first reflected light beams areprojected onto the object through light-transmitting element andreflected by the object to form second reflected light beams, and thenthe second reflected light beams are projected onto the image-capturingunit through the optical imaging unit.
 6. The image-capturing moduleaccording to claim 5, wherein the substrate unit is a printed circuitboard, and the image-capturing element is an image sensor.
 7. Theimage-capturing module according to claim 5, wherein the light-emittingelement is a light emitting diode.
 8. The image-capturing moduleaccording to claim 5, wherein the reflective layer is a reflectiveelement adhered to the inner surface of the cover unit or a reflectivecoated film coated on the inner surface of the cover unit.
 9. Animage-capturing module comprising: a substrate unit having a bended endportion; an image-capturing unit including an image-capturing elementdisposed on the substrate unit and electrically connected to thesubstrate unit; an optical imaging unit disposed on the substrate unitto cover the image-capturing unit, wherein the optical imaging unit hasat least one inclined surface formed on an outer surface thereof, andthe bended end portion of the substrate unit is bent and disposed on theat least one inclined surface of the optical imaging unit; alight-emitting unit including at least one light-emitting elementdisposed on the bended end portion of the substrate unit andelectrically connected to the bended end portion of the substrate unitfor generating light beams; and a cover unit disposed on the substrateunit to cover the optical imaging unit and the light-emitting unit,wherein the cover unit includes a light-transmitting element disposedabove the optical imaging unit; wherein an object is disposed on thelight-transmitting element, the light beams generated by the at leastone light-emitting element are projected onto the object throughlight-transmitting element and reflected by the object to form reflectedlight beams, and then the reflected light beams are projected onto theimage-capturing unit through the optical imaging unit.
 10. Theimage-capturing module according to claim 9, wherein the substrate unitis a printed circuit board, and the image-capturing element is an imagesensor.
 11. The image-capturing module according to claim 9, wherein thelight-emitting element is a light emitting diode.